Mid Tier North American and Foreign Sources

• Prototype/Short run, low to high volume, full turnkey,
  repair/refurbishment
• DFM and DFT engineering
• Technologies/Capabilities:
  • Surface Mount
  • Automatic Insertion
  • Potting
  • Burn In
  • Conformal Coating
  • Fine Pitch
  • BGA Assembly
  • Ceramic Ball Grid Array (CBGA)
  • Chip on Substrate (COS)
  • Multi - Chip Module (MCM)
  • HP 3070 In-Circuit Test Channel Partner
  • HP Four PI 5 DX X-ray Laminography Channel Partner
  • Balling/Reballing BGA
• Consignment/Inventory management programs
• Minority Ownership
• ISO Certified